| sB320thrusB360 \@ Vishay General Semiconductor 7 THEITMAL cHARAcTE sT cs (TA 25 °C unless otherwise noted) PARAMETER Typical thermal resistance Note‘ll Thermal resistance from junction to lead vertical P.C.B. mounting, 0.500“ (12.7 mm) lead length with 2.5“ x 2.5" (63.5 mm x 63.5 mm) copper pad PREFERREDP/N UN-Twe-Gnrigi mm 11 mm jj RATINGS AND cHAnAcTERIsTIcs cunves(TA : 25 °C unless otherwise noted) 100ii Eg (30 gE EE O 1 Resistive or inductive Load0.375“ (9.5 mm) Lead Lengtn ' 9-) 10: ._ u.0 I?u. 33 85 E 0 10’ _ .> E( S8320 tnru S5340 5 _ _ _ _ S8350 and SE360 E sB32u tnru sE!34o . . . _ S5350 and SBEGD 0.010 25 50 75 100 125 150 175 0 0.2 0.4 us 0.5 1.0 1.2 1.4 16 Lead Temperature (“C) Instantaneous Forward Voltage (V) Fig. 1 - Forward Current Derating Curve Fig. 3 - Typical Instantaneous Forward characteristics 10 150 TJ:TJMax8 msSing1eHa|iSin Wave 120 "I | I w:1 o 0):1 u.u1 Peak Fonlvard Surge Current (A) E’ instantaneous Reverse Current (mA) 1 10 100 Number of Cycles at 60 Hz Percent of Rated Peak Reverse Voltage (%) Fig. 2 - Maximum Non-Repetitive Peak FonNard Surge Current Fig. 4 - Typical Reverse Characteristics www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 887192 DiodesAmericas@vishay.com, DiodesAsIa@vishay.com, DiodesEuroge@vishay.com Revision: 19-Oct-09 |